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BSI
FEATURES
Very Low Power/Voltage CMOS SRAM 256K x 16 or 512K x 8 bit switchable
DESCRIPTION
BS616LV4020
* Very low operation voltage : 2.7 ~ 3.6V * Very low power consumption : Vcc = 3.0V C-grade: 20mA (Max.) operating current I-grade : 25mA (Max.) operating current 0.5uA (Typ.) CMOS standby current * High speed access time : -70 70ns (Max.) at Vcc=3.0V -10 100ns (Max.) at Vcc=3.0V *Automatic power down when chip is deselected * Three state outputs and TTL compatible * Fully static operation * Data retention supply voltage as low as 1.5V * Easy expansion with CE1, CE2 and OE options * I/O Configuration x8/x16 selectable by CIO, LB and UB pin
The BS616LV4020 is a high performance, very low power CMOS Static Random Access Memory organized as 262,144 words by 16 bits or 524,288 bytes by 8 bits selectable by CIO pin and operates from a wide range of 2.7V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 0.5uA and maximum access time of 70/100ns in 3V operation. Easy memory expansion is provided by active HIGH chip enable2(CE2), active LOW chip enable1(CE1), active LOW output enable(OE) and three-state output drivers. The BS616LV4020 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS616LV4020 is available in DICE form and 48-pin BGA type.
PRODUCT FAMILY
OPERATING TEMPERATURE SPEED (ns)
Vcc=3.0V
POWER DISSIPATION STANDBY Operating
(ICCSB1, Max) (ICC, Max)
PRODUCT FAMILY
Vcc RANGE
PKG TYPE
Vcc=3.0V
Vcc=3.0V
BS616LV4020DC BS616LV4020AC BS616LV4020BC BS616LV4020DI BS616LV4020AI BS616LV4020BI
+0 C to +70 C
O O
O
O
2.7V ~ 3.6V
70 / 100
8uA
20mA
-40 C to +85 C
2.7V ~ 3.6V
70 / 100
12uA
25mA
DICE BGA-48-0608 BGA-48-0810 DICE BGA-48-0608 BGA-48-0810
PIN CONFIGURATION
BLOCK DIAGRAM
A15 A14 A13 A12 A11 A10 A9 A8 A17 A7 A6 Address Input Buffer 22 Row Decoder 2048 Memory Array 2048 x 2048
2048 D0 16(8) Data Input Buffer 16(8) Column I/O
. . . .
D15 CE1 CE2 WE OE UB LB CIO Vdd Vss
. . . .
Write Driver
16(8) Sense Amp 128(256) Column Decoder
16(8) Data Output
Buffer
14(16) Control Address Input Buffer
A16 A0 A1 A2 A3 A4 A5
(SAE)
Brilliance Semiconductor Inc. reserves the right to modify document contents without notice.
R0201-BS616LV4020
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Revision 2.3 April 2002
BSI
PIN DESCRIPTIONS
BS616LV4020
Name
A0-A17 Address Input SAE Address Input CIO x8/x16 select input
Function
These 18 address inputs select one of the 262,144 x 16-bit words in the RAM. This address input incorporates with the above 18 address input select one of the 524,288 x 8-bit bytes in the RAM if the CIO is LOW. Don't use when CIO is HIGH. This input selects the organization of the SRAM. 262,144 x 16-bit words configuration is selected if CIO is HIGH. 524,288 x 8-bit bytes configuration is selected if CIO is LOW.
CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input
CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location.
WE Write Enable Input
OE Output Enable Input
The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive.
LB and UB Data Byte Control Input DQ0 - DQ15 Data Input/Output Ports Vcc Gnd
Lower byte and upper byte data input/output control pins. The chipis deselected when both LB and UB pins are HIGH. These 16 bi-directional ports are used to read data from or write data into the RAM. Power Supply Ground
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Revision 2.3 April 2002
BSI
TRUTH TABLE
MODE CE1 H Fully Standby X Output Disable L L H H H X CE2 X X X X X X L Read from SRAM L ( WORD mode ) H L H H H L L Write to SRAM L ( WORD mode ) H X L H H L Read from SRAM L ( BYTE Mode ) Write to SRAM L ( BYTE Mode ) H X L L X X A-1 H L H L X X A-1 L L X L L H X X X H X OE WE CIO LB X UB X X SAE
BS616LV4020
D0~7
D8~15
VCC Current
High-Z
High-Z
ICCSB, ICCSB1
High-Z Dout High-Z Dout Din X Din Dout
High-Z High-Z Dout Dout X Din Din High-Z
ICC
ICC
ICC
ICC
Din
X
ICC
ABSOLUTE MAXIMUM RATINGS(1)
SYMBOL VTERM TBIAS TSTG PT IOUT PARAMETER
Terminal Voltage Respect to GND with
OPERATING RANGE
UNITS
V
O
RATING
-0.5 to Vcc+0.5 -40 to +125 -60 to +150 1.0 20
RANGE
Commercial Industrial
AMBIENT TEMPERATURE
0 O C to +70 O C -40 C to +85 C
O O
Vcc
2.7V ~ 3.6V 2.7V ~ 3.6V
Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
C C
O
W mA
CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz)
SYMBOL
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CIN CDQ
PARAMETER Input Capacitance Input/Output Capacitance
CONDITIONS
MAX.
UNIT
VIN=0V VI/O=0V
6 8
pF pF
1. This parameter is guaranteed and not tested.
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Revision 2.3 April 2002
BSI
DC ELECTRICAL CHARACTERISTICS (TA = 0oC to +70oC) PARAMETER NAME
VIL VIH I IL I OL V OL VOH I CC I CCSB
BS616LV4020
PARAMETER
Guaranteed Input Low Voltage (2) Guaranteed Input High Voltage (2) Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Standby Current -TTL
TEST CONDITIONS
Vcc=3V Vcc=3V
(1) MIN. TYP. MAX.
UNITS
V V uA uA V V mA mA
-0.5 2.0 ---2.4 ---
---------
0.8 Vcc+0.2 1 1 0.4 -20 1
Vcc = Max, VIN = 0V to Vcc Vcc = Max, CE1 = VIH or CE2=VIL or OE = VIH, VI/O = 0V to Vcc Vcc = Max, IOL= 2mA Vcc = Min, IOH = -1mA Vcc = Max, CE1= VIL , CE2=V IH IDQ = 0mA, F = Fmax (3) Vcc = Max, CE1 = VIH or CE2=VIL IDQ = 0mA Vcc = Max, CE1 Vcc-0.2V or CE2 0.2V ;VIN Vcc - 0.2V or VIN 0.2V
Vcc=3V Vcc=3V
Vcc=3V
Vcc=3V
I CCSB1
Standby Current - MOS C
Vcc=3V
--
0.5
8
uA
1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. Fmax = 1/tRC .
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Revision 2.3 April 2002
BSI
DATA RETENTION CHARACTERISTICS ( TA = 0 to + 70oC )
SYMBOL
VDR
BS616LV4020
TEST CONDITIONS
CE1 VIN CE1 VIN Vcc - 0.2V or CE2 0.2V ; Vcc - 0.2V or VIN 0.2V Vcc - 0.2V or CE2 0.2V Vcc - 0.2V or VIN 0.2V
PARAMETER
Vcc for Data Retention
MIN. TYP.
1.5 --
(1)
MAX.
--
UNITS
V
ICCDR
Data Retention Current Chip Deselect to Data Retention Time
--
0.3
2
uA
tCDR tR
0 See Retention Waveform TRC (2)
---
---
ns ns
Operation Recovery Time
1. Vcc = 1.5V, TA = + 25OC 2. tRC = Read Cycle Time
LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled )
Data Retention Mode
Vcc
VIH
Vcc
VDR
1.5V
Vcc
t CDR
CE1 Vcc - 0.2V
tR
VIH
CE1
LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled )
Data Retention Mode
Vcc
Vcc
VDR
1.5V
Vcc
t CDR
tR
CE2 0.2V
CE2
VIL
VIL
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Revision 2.3 April 2002
BSI
AC TEST CONDITIONS
Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Vcc/0V 5ns 0.5Vcc
WAVEFORM
BS616LV4020
KEY TO SWITCHING WAVEFORMS
INPUTS MUST BE STEADY MAY CHANGE FROM H TO L
1269
OUTPUTS MUST BE STEADY WILL BE CHANGE FROM H TO L WILL BE CHANGE FROM L TO H CHANGE : STATE UNKNOWN CENTER LINE IS HIGH IMPEDANCE "OFF "STATE
AC TEST LOADS AND WAVEFORMS
3.3V OUTPUT
100PF
INCLUDING JIG AND SCOPE
1269
3.3V OUTPUT
MAY CHANGE FROM L TO H DON T CARE: ANY CHANGE PERMITTED DOES NOT APPLY
5PF 1404
INCLUDING JIG AND SCOPE
,
1404
FIGURE 1A
THEVENIN EQUIVALENT 667
FIGURE 1B
OUTPUT
1.73V
ALL INPUT PULSES
Vcc GND
10%
90% 90%
10%
5ns
FIGURE 2
AC ELECTRICAL CHARACTERISTICS (TA = 0oC to +70oC , Vcc=3.0V)
READ CYCLE
JEDEC PARAMETER NAME DESCRIPTION
Read Cycle Time Address Access Time Chip Select Access Time (CE1) (CE2) Chip Select Access Time Data Byte Control Access Time (LB,UB) Output Enable to Output Valid Chip Select to Output Low Z (CE2,CE1) Data Byte Control to Output Low Z (LB,UB) Output Enable to Output in Low Z Chip Deselect to Output in High Z (CE2,CE1) Data Byte Control to Output High Z (LB,UB) Output Disable to Output in High Z Output Disable to Output Address Change
PARAMETER NAME
BS616LV4020-70 MIN. TYP. MAX.
70 70 70 70 35 35 10 10 10 0 0 0 10
BS616LV4020-10 MIN. TYP. MAX.
100 100 100 100 50 50 15 15 15 0 0 0 15
UNIT
ns ns ns ns ns ns ns ns ns ns ns ns ns
tAVAX tAVQV tE1LQV tE2LQV tBA tGLQV tE1LQX tBE tGLQX tE1HQZ tBDO tGHQZ tAXQX
tRC tAA tACS1 tACS2 tBA(1) tOE tCLZ tBE tOLZ tCHZ tBDO tOHZ tOH
35 35 30
40 40 35
NOTE : 1. tBA is 35ns/50ns (@speed=70ns/100ns) with address toggle . tBA is 70ns/100ns (@speed=70ns/100ns) without address toggle .
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Revision 2.3 April 2002
BSI
SWITCHING WAVEFORMS (READ CYCLE)
READ CYCLE1 (1,2,4)
ADDRESS
BS616LV4020
t RC t
OH AA
t
D OUT
t OH
READ CYCLE2 (1,3,4)
CE2
t t
ACS2
ACS1
CE1
t
D OUT
(5) CLZ
t
CHZ
(5)
READ CYCLE3 (1,4)
ADDRESS
t
RC
t
OE
AA
t
CE2
OE
t
OH
t t t t
(5) CLZ
ACS2
CE1
OLZ
ACS1
t t
OHZ CHZ
(5)
(1,5)
LB,UB
t
BE
t t
BA
BDO
D OUT
NOTES: 1. WE is high for read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2 = VIH. 3. Address valid prior to or coincident with CE1 transition low and CE2 transition high. 4. OE = VIL . 5. Transition is measured 500mV from steady state with CL = 30pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested.
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Revision 2.3 April 2002
BSI
AC ELECTRICAL CHARACTERISTICS (TA = 0oC to +70oC , Vcc=3.0V) WRITE CYCLE
JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION
Write Cycle Time Chip Select to End of Write Address Set up Time Address Valid to End of Write Write Pulse Width (CE2, CE1, WE) Write Recovery Time Data Byte Control to End of Write (LB,UB) Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active
BS616LV4020
BS616LV4020-70 MIN.
70 70 0 70 35 0 30 0 30 0 0 5
BS616LV4020-10 MIN.
100 100 0 100 50 0 40 0 40 0 0 10
UNIT
ns ns ns ns ns ns ns ns ns ns ns ns
tAVAX tE1LWH tAVWL tAVWH tWLWH tWHAX tBW tWLQZ tDVWH tWHDX tGHQZ tWHQX
tWC tCW tAS tAW tWP tWR tBW (1) tWHZ tDW tDH tOHZ tOW
TYP.
MAX.
TYP.
MAX.
30
40
30
40
NOTE : 1. tBW is 30ns/40ns (@speed=70ns/100ns) with address toggle . tBW is 70ns/100ns (@speed=70ns/100ns) without address toggle .
SWITCHING WAVEFORMS (WRITE CYCLE)
WRITE CYCLE1 (1)
ADDRESS
t
WC
t WR
OE
(3)
CE2
(5)
t CW
CE1
(5)
(11)
t
LB,UB
(5)
BW
t AW
WE
(3)
t AS
(4,10)
t WP
(2)
t OHZ
D OUT
t DH t DW
D IN
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Revision 2.3 April 2002
BSI
WRITE CYCLE2 (1,6)
BS616LV4020
t WC
ADDRESS
CE2
(11)
CE1
(5)
t t
CW
BW
LB,UB
(5)
t
WE
AW
t WP
t
WR
(3)
(2)
t AS
(4,10)
t DH
(7) (8)
t WHZ
D OUT
t DW t
DH
(8,9)
D IN
NOTES:
1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE2, CE1 and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE2 going low, or CE1 or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE2 high transition or CE1 low transition or LB,UB low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE2 is high or CE1 is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured 500mV from steady state with CL = 30pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE2 going high or CE1 going low to the end of write.
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Revision 2.3 April 2002
BSI
ORDERING INFORMATION
BS616LV4020
BS616LV4020
XX
-- Y Y
SPEED 70: 70ns 10: 100ns GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC PACKAGE A :BGA - 48 PIN(6x8mm) B :BGA - 48 PIN(8x10mm) D :DICE
PACKAGE DIMENSIONS
NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.4 Max.
BALL PITCH e = 0.75 D 8.0 E 6.0 N 48 D1 5.25 E1 3.75
D1
e
VIEW A
48 mini-BGA (6 x 8mm)
R0201-BS616LV4020
E1
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Revision 2.3 April 2002
BSI
PACKAGE DIMENSIONS (continued)
0.25 0.05
NOTES:
BS616LV4020
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.4 Max.
SIDE VIEW
D 0.1 D1
N 48 D 10.0 E 8.0 D1 5.25 E1 3.75 e 0.75
SOLDER BALL
0.35
0.05
e
VIEW A
48 mini-BGA (8 x 10mm)
E 0.1
E1
R0201-BS616LV4020
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Revision 2.3 April 2002
BSI
REVISION HISTORY
Revision
2.2 2.3
BS616LV4020
Description
2001 Data Sheet release Modify some AC parameters
Date
Apr. 15, 2001 April,11,2002
Note
R0201-BS616LV4020
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Revision 2.3 April 2002

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